Quad Row & Grid Array


Flat package types like QFN, LCC, BGA, LGA that have contact pads can be tested in singulated form in strips or in diced strips.


When singulated, the DUTs (QFN, LCC, BGA, LGA ) are placed on carriers and can be tested with strip level test cell APOLLON.   Same is applicable also for testing of whole strips.


Testing of QFN, LCC, BGA, LGA packages is also possible with wafer level test system. In this case the strips are placed on film frame for testing, before or after dicing. Film frame size up to 8” are applicable for  KRONOS   and AIOLOS  systems.

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Configurable design allows you to create system you need!
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Vacuum probing, pressure probing, gas probing, humidity probing - AIOLOS is solution for these and much more.
KRONOS - Wafer level test handler for 6/9DOF sensors with real stimulus.